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本标准规定了银浆的技术要求，包括但不仅限于外观、颗粒度、固含量和粘度、烧结后的银层附着力和可焊性。
This Specification describes dimensional
inspection procedures and acceptance criteria
and simulating performance in the potential end use environments and manufacturing processes
Alternate methods can be used as long as method validation as per SEMI C1 has been demonstrated
E00400 - SEMI E4 - 半導体製造装置通信スタンダード1 メッセージトランスファ（SECS-I） Revision:SEMI E4-0699 (Reapproved 0307) - Superseded 本标准规定了银浆的技术要求，包括但不仅限于外观、颗粒度、固含量和粘度、烧结后的银层附着力和可焊性。NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI 1980SECS ISECS IA1.12 SECS I SECS ISECS Ipoint to pointSECS ISEMI E5, SEMI Equipment Communications Standard 2 Message Content 2 (SECS II) SECS Ipoint to pointSECS I R1 1. 1 SECS ISECS IRS 232 C SECS I SECS I SECS IEIA RS 232 CJIS C
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