G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds Revision:SEMI G69-0996 (Reapproved 1104) - Superseded SEMI E37-0413 (designation update)

SEMI E37-0413 (designation update)

This Document references SEMI E78

This has been done to establish a base for SMIF port standardization

1  This Test Method is to be used by suppliers and users of FPD color filters to measure quality in products as well as items under development

CP uses a stylus or probe tip that interacts with the surface of interest and moves at a known speed across the surface while recording the up and down movement of the tip relative to the surface

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds Revision:SEMI G69-0996 (Reapproved 1104) - Superseded SEMI E37-0413 (designation update)This Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a