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Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-51215 This standard does not apply

SKU: 65289903060

4.3
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Description

This standard does not apply to components manufactured by further processing of the product forms with quality characteristics altered as a result of such further processing

thread sizes M 12 to M 36 and property classes 10

Note 3: Temporary protection and maintenance of anodized aluminium after anodizing may be necessary

For avoiding such difficulties explanatory material and sections of other standards are collected in BS EN 61360-4

The units can be leg-mounted

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-51215 This standard does not apply

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