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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 6 This Specification does not

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Description

6  This Specification does not cover requirements for the following related types of silicon materials and wafers:

This Document applies to hydrogen (H2) delivered through specialty gas systems at pressures up to 8 × 105 Pa (8 atmospheres)

together with test methods suitable for determining their magnitudes

org in June 2011

It includes a specific transfer command state model and transport and storage system controller (TSSC) state model as the basis for all equipment of this class

G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 6 This Specification does notglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.

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