M05200 - SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations Revision:SEMI M52-0706 - Superseded This specification defines the physical

This specification defines the physical requirements for preforms made with thermosetting molding compounds

an interlaboratory precision as defined in ASTM E177

The Guide covers the selection of materials for resistivity reference wafers

SEMI E174-0618 (technical revision)

SEMI M55-0308 (technical revision)

M05200 - SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations Revision:SEMI M52-0706 - Superseded This specification defines the physical* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1